Circuit substrate
AssigneeEmcom Technology Inc.
InventorChu-Li Wang
Life of this patent
Estimating the term…
Abstract
The present invention discloses a circuit substrate, including a first signal end, a second signal end, a first circular capacitor structure, and a second circular capacitor structure. The first circular capacitor structure is electrically connected to the first signal end. The second circular capacitor structure is electrically connected to the second signal end. The first circular capacitor structure and the second circular capacitor structure are located in different planes of the circuit substrate.
Claims5
A circuit substrate capable of reducing a quantity of capacitance value variations caused by positive and negative tolerance of processes, comprising:
- a first signal end;
- a second signal end;
- a first circular capacitor structure, electrically connected to the first signal end;
- and
- a second circular capacitor structure, overlapped with the first circular capacitor structure and electrically connected to the second signal end, wherein
- the first circular capacitor structure and the second circular capacitor structure are located in different planes of the circuit substrate.
Dependencies are inferred from the claim text.