Silicon-based active material-polymer composite and method for preparing same
AssigneeLG Chem, Ltd.
InventorsRae Hwan Jo, Eun Kyung Kim, Yong Ju Lee, Su Jin Park, Hyun Chul Kim, Jung Hyun Choi
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Abstract
The present invention relates to a silicon-based active material-polymer composite which is secondary particles in which silicon-based particles as primary particles and conductive polymer particles having a modulus of elasticity of 10 Pa to 100 Pa at a temperature of 20° C. to 40° C. are uniformly mixed. The uniform mixture with the elastic conductive polymer particles provides for a buffering action against the stress generated by volumetric changes of the silicon-based particles.
Claims19
A silicon-based active material-polymer composite which is secondary particles in which silicon-based particles as primary particles and conductive polymer particles are mixed, wherein the conductive polymer particles have a modulus of elasticity of 10 Pa to 100 Pa at a temperature of 20° C. to 40° C.
A method for preparing a silicon-based active material-polymer composite, the method comprising the steps of:
- (1) preliminarily adding, to silicon-based particles which are primary particles, a conductive polymer having a volumetric modulus of elasticity of 10 Pa to 100 Pa at a temperature of 20° C. to 40° C. and preparing a mixture of the silicon-based particles and the conductive polymer;
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- (2) mechanically milling the mixture and preparing secondary particles in which the silicon-based particles and the conductive polymer are uniformly mixed.
Dependencies are inferred from the claim text.