Display substrate, method for manufacturing display substrate, display panel, and display device

A display panel, comprising:

• a display substrate;
• wherein,
• the display substrate comprises:
• a bonding region;
• a plurality of pads at intervals in the bonding region;
• and an insulating layer for spacing apart the pads, wherein a groove is in the insulating layer between at least two adjacent pads;
• and
• wherein,
• the display substrate further comprises:
• a base substrate, an active layer, a first metal layer, a second metal layer, a drain/source metal layer, a flat layer, an anode, a pixel defining layer, a light-emitting layer and a cathode;
• the insulating layer comprises a buffer layer, a first insulating layer, a second insulating layer, and an interlayer insulating layer;
• the buffer layer, the active layer, the first insulating layer, the first metal layer, the second insulating layer, the second metal layer, the interlayer insulating layer, the source/drain metal layer, the flat layer, the anode, the pixel defining layer, the light-emitting layer, and the cathode are sequentially on the base substrate;
• and
• a depth of the groove is no less than a sum of thicknesses of the second insulating layer and the interlayer insulating layer.

A display substrate, comprising:

• a base substrate;
• at least one insulating layer on a side of the base substrate;
• a first pad array on a side of the at least one insulating layer away from the base substrate;
• a second pad array on the side of the at least one insulating layer away from the base substrate;
• a groove in the at least one insulating layer between the first pad array and the second pad array;
• wherein the display substrate comprises a display region and a bonding region on a side of the display region;
• the first pad array and the second pad array are both in the bonding region, and the first pad array is closer to the display region relative to the second pad array;
• and
• the groove is configured to accommodate an overflow anisotropic conductive film during a bonding process;
• and
• wherein,
• the display substrate further comprising:
• an active layer, a first metal layer, a second metal layer, a drain/source metal layer, a flat layer, an anode, a pixel defining layer, a light-emitting layer and a cathode;
• the insulating layer comprises a buffer layer, a first insulating layer, a second insulating layer, and an interlayer insulating layer;
• the buffer layer, the active layer, the first insulating layer, the first metal layer, the second insulating layer, the second metal layer, the interlayer insulating layer, the source/drain metal layer, the flat layer, the anode, the pixel defining layer, the light-emitting layer, and the cathode are sequentially on the base substrate;
• and
• a depth of the groove is no less than a sum of thicknesses of the second insulating layer and the interlayer insulating layer.