MEMS piezoelectric transducer formed at a PCB support structure
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsJonathan Silvano De Sousa, Nick Renaud-Bezot
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Abstract
A microelectro-mechanical system (MEMS) device includes a support structure formed of printed circuit board (PCB) materials; and a piezoelectric transducer formed at the support structure. Further, a MEMS assembly is described which shows such a MEMS device mounted at a component carrier. Furthermore, a method for manufacturing such a MEMS device is described.
Claims20
A microelectromechanical system, MEMS, device, comprising:
- a support structure formed of printed circuit board, PCB, materials;
- and
- a piezoelectric transducer formed at the support structure, wherein the piezoelectric transducer is formed between two layers made from a FR4 material or between two epoxy-based build-up films and the piezoelectric transducer is electrically contacted via conductor traces formed on one of the two layers.
A microelectromechanical system (MEMS) assembly, comprising:
- a component carrier;
- and
- a MEMS device having a support structure formed of printed circuit board (PCB) materials with a piezoelectric transducer formed between two layers of a FR4 material or between two epoxy-based build-up films and with the piezoelectric transducer electrically contacted via conductor traces formed on one of the two layers, wherein the MEMS device is mounted at the component carrier.
A method for manufacturing a microelectromechanical system (MEMS) device, the method comprising:
- forming a support structure from printed circuit board (PCB) materials by using PCB manufacturing procedures;
- forming a piezoelectric transducer between two layers of a FR4 material or between two epoxy-based build-up films at the support structure;
- and
- electrically contacting the piezoelectric transducer with conductor traces formed on one of the two layers.
Dependencies are inferred from the claim text.