Semiconductor component comprising a first and a second shaped body and method for producing a semiconductor component comprising a first and a second shaped body

A method for producing a semiconductor component having the following steps

• providing a plurality of semiconductor chips, wherein each of the semiconductor chips comprises a semiconductor body having an active region and a carrier having a first conductor body, a second conductor body and a first shaped body, wherein the first shaped body is formed using a matrix material,
• attaching the semiconductor chips on to an auxiliary carrier,
• encapsulating the plurality of semiconductor chips with a second shaped body, such that the second shaped body surrounds the plurality of semiconductor chips completely in lateral directions (L) and the second shaped body directly borders each semiconductor chip,
• removing the auxiliary carrier, and
• singulating into a plurality of semiconductor components, wherein each semiconductor component comprises at least one semiconductor chip,
• wherein the matrix material comprises a thermoplastic and/or a thermoset and/or an epoxy material and/or a silicone material.

A semiconductor component having

• a semiconductor chip, which comprises a semiconductor body having an active region and a carrier having a first conductor body, a second conductor body and a first shaped body, and
• a second shaped body, wherein
• the second shaped body completely surrounds the semiconductor chip in lateral directions (L),
• the semiconductor chip completely penetrates the second shaped body in a vertical direction (V),
• a top side and a bottom side of the semiconductor chip are free from the second shaped body at least in some places,
• the carrier is mechanically connected to the semiconductor body,
• the active region is electrically connected to the first conductor body and the second conductor body,
• the second shaped body directly borders the semiconductor chip, in particular the carrier and the semiconductor body, and wherein the first shaped body completely encloses the first conductor body and the second conductor body in lateral directions.