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US 10,763,402 B2Granted
Light-emitting diode package
AssigneeLextar Electronics Corporation
InventorsShang-Hsun Tsai, Li-Wei Liu
Life of this patent
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Abstract
A light-emitting diode package includes a substrate, at least one light-emitting chip, a light-reflective layer and a wave-length conversion fluorescent layer. The light-emitting chip is located on the substrate. The light-reflective layer is arranged around the light-emitting chip. The wave-length conversion fluorescent layer is located over the light-emitting chip, wherein the light-reflective layer is spaced from the fluorescent wave-length conversion layer by a groove that reaches two opposite sides of the light-emitting diode package.
Claims8
A light-emitting diode package comprising:
- a substrate;
- at least one light-emitting chip disposed on the substrate;
- a light-reflective layer disposed around the light-emitting chip;
- and
- a wave-length conversion fluorescent layer disposed over the light-emitting chip, wherein the light-reflective layer is spaced from the fluorescent wave-length conversion layer by at least one groove of which the light-reflective layer and the fluorescent wave-length coversion layer define two opposite sidewalls, the at least one groove reaches two opposite sides of the light-emitting diode package.
2 more elements
Dependencies are inferred from the claim text.