Image sensor chips having sub-chips
AssigneeSamsung Electronics Co., Ltd.
InventorsJaekyu Lee, Sung In Kim, Byung-Joon Baek
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AssigneeSamsung Electronics Co., Ltd.
InventorsJaekyu Lee, Sung In Kim, Byung-Joon Baek
Estimating the term…
An image sensor chip may include a first sub-chip, a second sub-chip on the first sub-chip, and an interconnector between the first and second sub-chips. The first sub-chip may include a first substrate, a bottom electrode on a first region of the first substrate, and a first capacitor on the bottom electrode. The first capacitor may include a plurality of first electrodes vertically extending from a top surface of the bottom electrode, a second electrode on the first electrodes, and a first dielectric layer between the second electrode and the first electrodes. The second sub-chip may include a pixel array configured to convert incident light into an electrical signal. The pixel array may be electrically connected through the interconnector to the first capacitor.
An image sensor chip, comprising:
An image sensor chip, comprising:
An image sensor chip, comprising:
Dependencies are inferred from the claim text.