Semiconductor device and method for forming the same

A method for forming a semiconductor device, comprising:

• providing a substrate, wherein the substrate comprises a plurality of pixels;
• forming a light collimator layer on the substrate, wherein forming the light collimator layer on the substrate comprises:
• disposing a first material on the substrate, wherein the first material comprises a transparent material;
• patterning the first material to form a transparent connection feature on the substrate and a plurality of transparent pillars on the transparent connection feature covering the plurality of pixels, wherein the transparent connection feature is located between the plurality of transparent pillars and the substrate;
• forming a plurality of first light-shielding features on the transparent connection feature, wherein the first light-shielding features are formed of opaque materials, and wherein a top surface of one of the transparent pillars is level with a top surface of one of the first light-shielding features;
• and
• forming a plurality of second light-shielding features disposed on the substrate, wherein the transparent connection feature is located between the plurality of first light-shielding features and the plurality of second light-shielding features.