Semiconductor device comprising signal terminals extending from encapsulant

A semiconductor device comprising:

• a first semiconductor chip;
• a second semiconductor chip;
• an encapsulant encapsulating the first semiconductor chip and the second semiconductor chip;
• at least two first signal terminals extending over inside and outside of the encapsulant and connected to the first semiconductor chip inside the encapsulant;
• and
• at least two second signal terminals extending over the inside and the outside of the encapsulant and connected to the second semiconductor chip inside the encapsulant, wherein:
• the at least two first signal terminals and the at least two second signal terminals protrude from the encapsulant in a same direction,
• each of the at least two first signal terminals comprises, inside the encapsulant, a section where the first signal terminal extends farther away from the at least two second signal terminals along a direction toward the first semiconductor chip,
• each of the at least two second signal terminals comprises, inside the encapsulant, a section where the second signal terminal extends farther away from the at least two first signal terminals along a direction toward the second semiconductor chip and
• a distance outside the encapsulant between (i) any one of the at least two first signal terminals and (ii) any one of the at least two second signal terminals is smaller than a distance between the first semiconductor chip and the second semiconductor chip.