Method of aligning semiconductor chips, method of arranging semiconductor chips, device that produces a semiconductor component, and semiconductor component

A device that produces a semiconductor component having a light source, a first electrode, and a second electrode, comprising:

• means for adapting the light source to illuminate a region between the first and the second electrode with electromagnetic radiation,
• means for adapting the first and the second electrode to generate in the region an electric field,
• means for providing a suspension comprising a medium and semiconductor chips that arranges an electric field between the electrodes, and
• means for arranging a light source such that the second electrode has a surface with at least one cut-out, or the second electrode has a surface on which a light guide is arranged.

A semiconductor component comprising a carrier and a plurality of semiconductor chips, wherein

• the semiconductor chips each have a n-conducting region and a p-conducting region,
• at least 70% of the semiconductor chips have the same orientation and are in direct contact with the carrier,
• the semiconductor chips have a maximum edge length of 10 μm,
• the semiconductor chips are arranged on the carrier by printing, and
• the semiconductor chips are surrounded in the lateral plane by a cured medium.