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US 10,763,236 B2Granted
Systems and methods of operating wire bonding machines including clamping systems
AssigneeKulicke and Soffa Industries, Inc.
InventorsPeter J. Klaerner, Jason Fu, Christoph Benno Luechinger
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Abstract
A method of operating an ultrasonic bonding machine is provided. The method includes the steps of: (a) imaging at least one of (i) a semiconductor element supported by a substrate, and (ii) a clamping structure adapted for securing the substrate during a bonding operation; and (b) determining if a relative position of the semiconductor element and the clamping structure is acceptable using predetermined criteria and information from step (a).
Claims15
A method of operating a wire bonding machine, the method comprising the steps of:
- (a) imaging each of (i) a semiconductor element supported by a substrate, and (ii) a clamping structure adapted for securing the substrate during a bonding operation;
- and (b) determining if a relative position of the semiconductor element and the clamping structure is acceptable using predetermined criteria and information from step (a), establishing an acceptable relative position of the semiconductor element and the clamping structure prior to step (a), wherein the clamping structure includes at least one clamping finger for securing the substrate during the bonding operation.
An ultrasonic wire bonding machine comprising:
- a support structure for supporting a substrate, the substrate configured to carry a semiconductor element;
- a clamping structure for securing the substrate against the support structure during a bonding operation, wherein the clamping structure includes at least one clamping finger for securing the substrate during the bonding operation;
- an imaging system for imaging each of (i) a semiconductor element supported by a substrate, and (ii) a clamping structure adapted for securing the substrate during a bonding operation;
- and a computer configured to determine if a relative position of the semiconductor element and the clamping structure is acceptable using predetermined criteria and information from the imaging system.
1 more element
Dependencies are inferred from the claim text.