Batch bonding apparatus and bonding method

A batch bonding apparatus, comprising:

• a chip supply unit, configured to provide chips to be bonded;
• a substrate supply unit, configured to provide a substrate;
• a conveying unit, configured to transfer the chips between the chip supply unit and the substrate supply unit;
• and
• a pickup unit, disposed above the chip supply unit and configured to, pick up each chip from the chip supply unit and load the chip onto the conveying unit after flipping a mark surface of the chip to a required orientation,
• wherein the pickup unit comprises a first pickup assembly and a second pickup assembly, wherein the first pickup assembly is disposed above the chip supply unit, and comprises a first rotating part and a first pickup head disposed on the first rotating part, wherein the second pickup assembly comprises a second rotating part and a second pickup head disposed on the second rotating part, wherein the first pickup head picks up the chip from the chip supply unit and transfers the chip to the conveying unit or to the second pickup head.