Semiconductor structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsVincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Hao-Yi Tsai, Chen-Hua Yu, Wei-Ting Chen, Ming Hung Tseng, Yen-Liang Lin
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Abstract
A semiconductor structure includes a transceiver, a molding surrounding the transceiver, a plurality of vias extending through the molding, and a RDL disposed over the transceiver and the plurality of vias. In some embodiments, the RDL includes an antenna disposed over and electrically connected to the transceiver, and a dielectric layer surrounding the antenna. In some embodiments, the antenna includes an elongated portion extending over the molding and a via portion electrically connected to the transceiver.
Claims20
A semiconductor structure, comprising:
- a transceiver;
- a molding surrounding the transceiver;
- a plurality of vias extending through the molding;
- and
- a redistribution layer (RDL) disposed over the transceiver and the plurality of vias, wherein the RDL comprises:
- an antenna disposed over and electrically connected to the transceiver;
- and
- a dielectric layer surrounding the antenna,
- wherein the antenna comprises an elongated portion extending over the molding and a via portion electrically connected to the transceiver.
A semiconductor structure, comprising:
- a transceiver;
- a molding surrounding the transceiver;
- a plurality of vias extending through the molding;
- a redistribution layer (RDL) disposed over the transceiver and the plurality of vias, wherein the RDL comprises:
- an antenna disposed over and electrically connected to the transceiver;
- and
- a dielectric layer surrounding the antenna;
- and
- a pillar disposed between the antenna and the transceiver and surrounded by the molding, wherein the pillar electrically connects the antenna to the transceiver, wherein the antenna comprises an elongated portion extending over the molding and a via portion electrically connected to the pillar.
A semiconductor structure comprising:
- a transceiver;
- a molding surrounding the transceiver;
- a plurality of vias extending through the molding;
- an insulating layer disposed over the molding, the transceiver and the plurality of vias;
- a redistribution layer (RDL) disposed over the insulating layer, wherein the RDL comprises:
- an antenna disposed over and electrically connected to the transceiver;
- and
- a first interconnect structure electrically connected to the plurality of vias;
- and
- a pillar disposed between the antenna and the transceiver and surrounded by the molding, wherein the pillar electrically connects the antenna to the transceiver, wherein a portion of the antenna extends through the insulating layer to electrically connect to the pillar.
Dependencies are inferred from the claim text.