Antenna module
AssigneeSamsung Electronics Co., Ltd.
InventorsDoo Il Kim, Yong Ho Baek, Jin Seon Park, Young Sik Hur
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AssigneeSamsung Electronics Co., Ltd.
InventorsDoo Il Kim, Yong Ho Baek, Jin Seon Park, Young Sik Hur
Estimating the term…
An antenna module includes a fan-out semiconductor package including an IC, an encapsulant encapsulating at least a portion of the IC, a core member having a first side surface facing the IC or the encapsulant, and a connection member including at least one wiring layer electrically connected to the IC and the core member and at least one insulating layer; and an antenna package including a plurality of first directional antenna members configured to transmit or receive a first RF signal. The fan-out semiconductor package further includes at least one second directional antenna member disposed on a second side surface of the core member opposing the first side surface of the core member, stood up from a position electrically connected to at least one wiring layer, and configured to transmit or receive a second RF signal.
An antenna module comprising:
An antenna module comprising:
An antenna module comprising:
Dependencies are inferred from the claim text.