Semiconductor structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYing-Ju Chen, Hsien-Wei Chen, Ming-Fa Chen
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Abstract
A semiconductor structure includes a die, a molding surrounding the die, a first seal ring disposed over the molding, and a second seal ring disposed below the molding. The semiconductor structure further includes a first interconnect structure disposed below the first surface of the die and a second interconnect structure disposed over the second surface and the molding. The first seal ring is disposed in the second interconnect structure and disposed over the molding, and the second seal ring is provided within the die and the first interconnect structure.
Claims20
A semiconductor structure, comprising:
- a die including a first surface and a second surface opposite to the first surface;
- a molding surrounding the die;
- a first seal ring disposed over the molding;
- and
- a second seal ring disposed below the molding.
A semiconductor structure, comprising:
- a die including a first surface and a second surface opposite to the first surface;
- a first interconnect structure disposed below the first surface of the die;
- a molding surrounding the die and the first interconnect structure;
- a second interconnect structure disposed over the second surface and the molding;
- a first seal ring disposed in the second interconnect structure and disposed over the molding;
- and
- a second seal ring provided within the die and the first interconnect structure.
A semiconductor structure comprising:
- a die including a first surface and a second surface opposite to the first surface;
- a first interconnect structure disposed below the first surface of the die;
- a molding surrounding the die and the first interconnect structure;
- a second interconnect structure disposed over the second surface of the die and the molding;
- a third interconnect structure disposed below the first interconnect structure and molding;
- a first seal ring disposed in the second interconnect structure and disposed over the molding;
- a second seal ring vertically extended within the die and the first interconnect structure;
- and
- a third seal ring disposed in the third interconnect structure and disposed over the molding.
Dependencies are inferred from the claim text.