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US 10,763,223 B2Granted
Substrate structure having chamfers
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsPo-Hao Wang, Chang-Fu Lin, Chun-Tang Lin, Bo-Hao Chang
Life of this patent
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Abstract
Provided is a substrate structure, including a substrate having at least one chamfer formed on a surface thereof, and a plurality of conductive bodies formed to the substrate. Therefore, a stress generated during the packaging process is alleviated through the chamfer, and the substrate structure is prevented from being cracked. An electronic package employing the substrate structure is also provided.
Claims13
A substrate structure, comprising:
- a substrate including at least one first chamfer formed on a surface thereof, a second chamfer extending from the first chamfer, and a third chamfer extending from the second chamfer in a first direction different from a second direction in which the second chamfer extends from the first chamfer, wherein the first chamfer, the second chamfer, and the third chamfer are not perpendicular to the surface, and the first chamfer is inclined relative to the surface;
- and
- a plurality of conductive bodies formed to the surface of the substrate.
Dependencies are inferred from the claim text.