Electrical devices and methods for forming electrical devices
AssigneeIntel Corporation
InventorsSruti Chigullapalli, Leslie Fitch, Boping Wu
Life of this patent
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Abstract
An electrical device includes at least one electrical component arranged on a carrier substrate and sidewalls of an electromagnetic shielding encapsulation arranged on the carrier substrate. The sidewalls of the electromagnetic shielding encapsulation laterally surround the at least one electrical component. Further, the electrical device includes a heat sink mounted to the sidewalls of the electromagnetic shielding encapsulation. The heat sink forms a cap of the electromagnetic shielding encapsulation and the heat sink includes surface-enlarging structures at a front side of the heat sink.
Claims19
An electrical device comprising:
- at least one electrical component arranged on a carrier substrate;
- sidewalls of an electromagnetic shielding encapsulation arranged on the carrier substrate, wherein the sidewalls of the electromagnetic shielding encapsulation laterally surround the at least one electrical component;
- and
- a heat sink mounted to the sidewalls of the electromagnetic shielding encapsulation, wherein the heat sink forms a cap of the electromagnetic shielding encapsulation, wherein the heat sink comprises surface-enlarging structures at a front side of the heat sink, and
- wherein the heat sink is fixed on the sidewalls of an electromagnetic shielding encapsulation by a gasket material,
- wherein the gasket material has a thermal conductivity of more than 3 W/(m*K), and
- wherein the gasket material has an electrical resistivity of less than 1*10−3 Ωm.
A method for forming an electrical device, the method comprising:
- attaching at least one electrical component on a carrier substrate;
- forming or attaching side walls of an electromagnetic shielding encapsulation on the carrier substrate before or after attaching the at least one electrical component, wherein the sidewalls of the electromagnetic shielding encapsulation laterally surround the at least one electrical component;
- and
- mounting a heat sink to the sidewalls of the electromagnetic shielding encapsulation,
- wherein the heat sink forms a cap of the electromagnetic shielding encapsulation,
- wherein the heat sink comprises surface-enlarging structures at a front side of the heat sink, and
- wherein mounting the heat sink comprises fixing the heat sink on the sidewalls of an electromagnetic shielding encapsulation by a gasket material,
- wherein the gasket material has a thermal conductivity of more than 3 W/(m*K), and
- wherein the gasket material has an electrical resistivity of less than 1*10−3 Ωm.
Dependencies are inferred from the claim text.