Semiconductor package and antenna module including the same

An antenna module comprising:

• an antenna substrate including an antenna pattern;
• and
• a semiconductor package disposed on a lower surface of the antenna substrate and electrically connected to the antenna substrate, and having at least one semiconductor chip and at least one wiring chip embedded therein,
• wherein each of the at least one wiring chip includes a body portion and a plurality of through vias penetrating the body portion and electrically connecting the antenna substrate and the at least one semiconductor chip, and the semiconductor package includes a metal layer disposed between the at least one semiconductor chip and the at least one wiring chip to shield the at least one wiring chip.

An antenna module comprising:

• a semiconductor chip disposed in a first through-hole of a frame, the semiconductor chip having an active surface comprising a connection pad;
• a wiring chip disposed in a second through-hole of the frame, the second through-hole being disposed outwardly of the semiconductor chip, the wiring chip comprising conducting through vias penetrating an insulating body;
• an antenna substrate having an antenna pattern on an upper surface and a wiring layer disposed on a lower surface;
• and
• a connection member disposed between the active surface and the wiring layer, and the electrically connecting the through vias, the connection pad and the wiring layer.