Semiconductor device

A semiconductor device comprising:

• a wiring substrate having a first main surface, a second main surface opposite the first main surface and a plurality of wiring layers;
• a first semiconductor chip having a first front surface, a first rear surface opposite the first front surface and mounted on the wiring substrate such that the first front surface faces the first main surface of the wiring substrate;
• and
• a first chip component having a second front surface and a second rear surface opposite the second front surface,
• wherein the first semiconductor chip includes a first circuit and a first electrode pad formed on the first front surface,
• wherein the first electrode pad for a first signal is electrically connected with the first circuit,
• wherein the first chip component includes a plurality of kinds of passive elements, a second circuit correcting a waveform of the first signal, and a second electrode pad formed on the second front surface of the first chip component
• wherein the second electrode pad is electrically connected with the second circuit and the first electrode pad of the first semiconductor chip,
• wherein the wiring substrate includes a first terminal electrically connected with the first electrode pad of the first semiconductor chip via a first conductive member, and a first wire electrically connected with the first terminal and the second electrode pad of the first chip component, and
• wherein a path distance from the first electrode pad of the first semiconductor chip to the second electrode pad of the chip component is in a range of 1/16 of a wavelength of the first signal to 3.5/16 of the wavelength thereof.