Conductive trace design for smart card

A smart card, comprising:

• a substrate having first and second opposing major surfaces;
• a die receiving area formed in the first major surface of the substrate;
• a plurality of conductive vias that generally surround the die receiving area, wherein the conductive vias extend from the first major surface to the second major surface;
• a conductive coating formed on the second major surface of the substrate, wherein the conductive coating is patterned to form a plurality of electrical contact pads over the plurality of conductive vias;
• at least one conductive trace formed on the first major surface of the substrate, wherein the conductive trace extends between at least two adjacent vias and wherein the conductive traces does not fully surround the at least two adjacent conductive vias;
• an integrated circuit chip disposed within the die receiving area;
• and
• a plurality of electrical connections that electrically connect the integrated circuit chip to respective ones of the conductive vias, wherein the portions of the at least one conductive trace that partially surround said at least two adjacent conductive vias are configured so that bond wires that extend from the integrated circuit chip to said at least two adjacent conductive traces extend over portions of the at least two adjacent conductive vias that are not surrounded by the conductive traces.