# US 10,763,201 B2 · Lead and lead frame for power package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,763,201 B2 - Document ID: US10763201B2 - Status: Granted - Kind: B2 - Application number: 15/821,822 - Filed: 2017-11-23 - Published: 2018-04-05 - Granted: 2020-09-01 - Earliest claimed: 2009-03-03 - Assignees: Littelfuse, Inc. - Applicants: Littelfuse, Inc. - Inventors: Nathan Zommer; Kang Rim Choi - Web page: https://patentgrep.com/patent/US10763201B2 ## CPC - H10W 70/65: Shapes or dispositions of interconnections - H10W 70/421: {Shapes or dispositions} - H10W 70/427: {Bent parts} - H10W 70/466: {Tape carriers or flat leads} - H10W 70/481: {for devices being provided for in groups H10D8/00 - H10D48/00} - H10W 70/658: {for devices provided for in groups H10D8/00 - H10D48/00} - H10W 72/073: {of die-attach connectors} - H10W 72/07336: {Soldering or alloying} - H10W 72/075: {of bond wires} - H10W 72/076: {of strap connectors} - H10W 72/07636: {Soldering or alloying} - H10W 72/30: Die-attach connectors - H10W 72/50: Bond wires - H10W 72/551: {Materials of bond wires} - H10W 72/652: {comprising metals or metalloids, e.g. silver} - H10W 72/655: {of outermost layers of multilayered strap connectors, e.g. material of a coating} - H10W 72/871: {Bond wires and strap connectors} - H10W 72/926: {Multiple bond pads having different sizes} - H10W 72/932: {Plan-view shape, i.e. in top view} - H10W 72/951: {Materials of bond pads} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/111: {the semiconductor body being completely enclosed} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W 90/766: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W 99/00: Subject matter not provided for in other groups of this subclass - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A power device includes a semiconductor chip provided over a substrate, and a patterned lead. The patterned lead includes a raised portion located between a main portion and an end portion. At least part of the raised portion is positioned over the semiconductor chip at a larger height than both the main portion and the end portion. A bonding pad may also be included. The end portion may include a raised portion, bonded portion, and connecting portion. At least part of the bonded portion is bonded to the bonding pad and at least part of the raised portion is positioned over the bonding pad at a larger height than the bonded portion and connecting portion. The end portion may also include a plurality of similarly raised portions. ## Claims ### Claim 1 A power device comprising: an encapsulating material; and a semiconductor chip; and a lead comprising a main portion, a first raised portion, and an end portion having a connecting portion, a second raised portion, and a bonded portion, wherein the main portion is separated from the end portion by the first raised portion, wherein the first raised portion extends from the connecting portion towards the main portion along a first direction, wherein the second raised portion extends from the connecting portion towards the bonded portion along a second direction, wherein the bonded portion is separated from the connecting portion by the second raised portion, wherein the first direction and the second direction are nonparallel, wherein the lead is part of leadframe metal, and wherein the main portion extends from outside the encapsulating material, wherein the bonded portion is electrically connected to the semiconductor chip, wherein the lead is not electrically connected to the semiconductor chip at the main portion, the first raised portion, the connecting portion or at the second raised portion. ### Claim 2 (depends on 1) The power device of claim 1, wherein the end portion of the lead comprises the second raised portion, the bonded portion, and the connecting portion. ### Claim 3 (depends on 1) The power device of claim 1, wherein the main portion of the lead extends along the first direction, and wherein the first direction is perpendicular to the second direction. ### Claim 4 (depends on 1) The power device of claim 1, wherein the second raised portion is not in physical contact with any bonding pad. ### Claim 5 (depends on 1) The power device of claim 1, wherein the connecting portion of the end portion extends along an arc from the first raised portion towards the second raised portion such that the connecting portion forms an arc shaped projection on a surface of a semiconductor device. ### Claim 6 (depends on 1) The power device of claim 1, wherein the lead is a single piece of electrically conductive material formed from a single sheet of the leadframe metal. ### Claim 7 A power device comprising: encapsulating material; a semiconductor chip; and a lead comprising a main portion, a first raised portion, a connecting portion, a second raised portion, and a bonded portion, wherein the main portion is separated from the connecting portion by the first raised portion, wherein the connecting portion is separated from the bonded portion by the second raised portion, wherein the first raised portion extends from the connecting portion to the main portion along a first axis, wherein the second raised portion extends from the connecting portion to the bonded portion along a second axis, wherein the bonded portion is separated from the connecting portion by the second raised portion, wherein the first and second axes converge, wherein the lead is an integral piece of leadframe metal, and wherein the main portion extends from outside the encapsulating material, wherein the bonded portion is electrically connected to the semiconductor chip, wherein the lead is not electrically connected to the semiconductor chip at the main portion, the first raised portion, the connecting portion or at the second raised portion. ### Claim 8 (depends on 7) The power device of claim 7, wherein at least part of the second raised portion is positioned above a semiconductor device at a greater height than each of the bonded portion, the connecting portion, and the main portion. ### Claim 9 (depends on 7) The power device of claim 7, wherein the main portion extends along a first direction, wherein the first raised portion extends along the first direction, wherein the second raised portion extends along a second direction, and wherein the first direction is perpendicular to the second direction. ### Claim 10 (depends on 7) The power device of claim 7, wherein the second raised portion is not in physical contact with any bonding pad. ### Claim 11 (depends on 7) The power device of claim 7, wherein the connecting portion extends along an arc from the first raised portion towards the second raised portion, and wherein the arc is projected onto a surface of a semiconductor device. ### Claim 12 (depends on 7) The power device of claim 7, wherein the lead is a single piece of electrically conductive material formed from a single sheet of the leadframe metal. ### Claim 13 A lead frame comprising: a semiconductor chip; and a lead having a main portion, a first raised portion, a connecting portion, a second raised portion, and a bonded portion, wherein the lead is formed from a single piece of metal, wherein the main portion is separated from the connecting portion by the first raised portion that extends from the main portion to the connecting portion along a first axis, wherein the connecting portion is separated from the bonded portion by the second raised portion that extends from the connecting portion to the bonded portion along a second axis, wherein the bonded portion is separated from the connecting portion by the second raised portion, wherein the first axis and the second axis are noncollinear axes, and wherein the main portion extends from outside encapsulating material, wherein the bonded portion is electrically connected to the semiconductor chip, wherein the lead is not electrically connected to the semiconductor chip at the main portion, the first raised portion, the connecting portion or at the second raised portion. ### Claim 14 (depends on 13) The lead frame of claim 13, wherein at least part of the second raised portion is positioned above a semiconductor chip at a greater height than each of the bonded portion, the connecting portion, and the main portion. ### Claim 15 (depends on 13) The lead frame of claim 13, wherein the lead is a single piece of electrically conductive material that is patterned from a single sheet of a metal layer. ### Claim 16 (depends on 13) The lead frame of claim 13, wherein the main portion extends along a first direction, wherein the first raised portion extends along the first direction, wherein the second raised portion extends along a second direction, and wherein the first direction is not parallel to the second direction. ### Claim 17 (depends on 13) The lead frame of claim 13, wherein the second raised portion is not in physical contact with a bonding pad. ### Claim 18 (depends on 13) The lead frame of claim 13, wherein the connecting portion extends along an arc from the first raised portion towards the second raised portion such that the connecting portion forms an arc shaped projection on a surface of a power semiconductor chip.