# US 10,763,200 B2 · Mounting structure and module

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- Number: US 10,763,200 B2
- Document ID: US10763200B2
- Status: Granted
- Kind: B2
- Application number: 15/746,900
- Filed: 2017-02-01
- Published: 2020-03-19
- Granted: 2020-09-01
- Earliest claimed: 2016-02-29
- Assignees: Fujikura Ltd.
- Applicants: Fujikura Ltd.
- Inventors: Kohei Matsumaru
- Web page: https://patentgrep.com/patent/US10763200B2

## CPC

- H10W 70/65: Shapes or dispositions of interconnections
- H05K 3/34: by soldering
- H10W 70/63: Vias, e.g. via plugs
- H10W 72/072: {of bump connectors}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/287: {Flow barriers}
- H10W 72/29: Bond pads specially adapted therefor
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A mounting structure includes a semiconductor device including a first terminal, a wiring substrate including a second terminal having a first end, a wiring extracted from an end face of the first end, and a photosensitive insulating film that covers the wiring and the first end, the second terminal being disposed facing the first terminal, and a bump that electrically connects the first terminal and the second terminal.

## Claims

### Claim 1

A mounting structure comprising:
a semiconductor device including a first terminal;
a wiring substrate including a second terminal having a first end, a wiring extracted from an end face of the first end, and a photosensitive insulating film that covers the wiring and the first end, the second terminal being disposed facing the first terminal, the second terminal and the wiring being provided on one surface of the wiring substrate such that the second terminal and the wiring are in direct contact with the one surface of the wiring substrate; and
a bump that electrically connects the first terminal and the second terminal.

### Claim 2 (depends on 1)

The mounting structure according to claim 1, wherein the first terminal includes a plurality of the first terminals,
the second terminal includes a plurality of the second terminals, and the wiring includes a plurality of the wirings extracted from the plurality of the second terminals respectively,
the bump includes a plurality of the bumps which are provided between the plurality of the first terminals and the plurality of the second terminals respectively,
the plurality of the first terminals are provided in parallel with each other in a peripheral portion of the semiconductor device, and
the plurality of the second terminals and the plurality of the bumps are provided in parallel with each other so as to correspond to the plurality of the first terminals.

### Claim 3 (depends on 2)

The mounting structure according to claim 2, wherein a plurality of third terminals are provided on ends opposite to the plurality of the second terminals in the plurality of the wirings, and
the plurality of the third terminals are provided in parallel with each other at a pitch wider than that of the plurality of the first terminals.

### Claim 4 (depends on 2)

The mounting structure according to claim 2, wherein coverage rates at which the photosensitive insulating film covers the plurality of the second terminals are equal to each other between the plurality of the second terminals.

### Claim 5 (depends on 2)

The mounting structure according to claim 2, wherein
an end of the photosensitive insulating film that covers the plurality of the first ends of the plurality of the second terminals is formed along a parallel direction of the plurality of the second terminals.

### Claim 6 (depends on 1)

A module comprising the mounting structure according to claim 1.

### Claim 7 (depends on 5)

The mounting structure according to claim 5, wherein
the photosensitive insulating film covers an upper surface of the plurality of the first ends of the plurality of the second terminals.

### Claim 8 (depends on 1)

The mounting structure according to claim 1, wherein
the second terminal includes a second end located opposite to the first end along a plane direction of the wiring substrate, the second end being exposed from the photosensitive insulating film.