Semiconductor package structure and method for preparing the same

Abstract

The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate having a front surface and a back surface opposite to the front surface, an interconnection structure disposed over the front surface of the substrate, a first passivation layer disposed over the back surface of the substrate, a second passivation layer disposed over the first passivation layer, and a TSV disposed in the substrate. In some embodiments, the TSV structure penetrates the substrate from the back surface of the substrate to the front surface of the substrate. In some embodiments, the TSV has an end portion protruding from the first passivation layer and separated from the second passivation layer.

Dependencies are inferred from the claim text.