Electronic apparatus and circuit board thereof
AssigneeRealtek Semiconductor Corp.
InventorsChao-Min Lai, Hung-Wei Wang, Ping-Chia Wang
Life of this patent
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Abstract
An electronic apparatus and a circuit board thereof are provided. The electronic apparatus includes a control device that can operate with the circuit board, and includes a ball pad array. The ball pad array includes a plurality of power ball pads and a plurality of ground ball pads, which are arranged in the same pad arrangement region. At least a portion of the power ball pads and at least a portion of the ground ball pads are arranged in an alternate manner. The circuit board includes a solder pad array corresponding to the ball pad array of the control device so as to be disposed with the control device.
Claims18
A circuit board, comprising:
- a laminated board having a first surface and a second surface opposite to the first surface, wherein the laminated board includes a ground layer and a power layer, the power layer being insulated from the ground layer;
- and
- a solder pad array disposed on the first surface, wherein the solder pad array includes a plurality of power solder pads electrically connected to the power layer and a plurality of ground solder pads electrically connected to the ground layer, the power solder pads and the ground solder pads are arranged in a first predetermined region of the first surface, and a portion of the ground solder pads and a portion of the power solder pads are arranged in an alternate manner;
- and
- a plurality of contact pad sets disposed on the second surface, wherein the contact pad sets and the solder pad array are respectively located at two opposite sides of the laminated board, each of the contact pad sets includes an anode contact pad and a cathode contact pad, an arrangement of the anode and cathode contact pads of one of the contact pad sets is opposite to an arrangement of the anode and cathode contact pads of another one of the contact pad sets.
An electronic apparatus, comprising:
- a circuit board including:
- a laminated board having a first surface and a second surface opposite to the first surface, wherein the laminated board includes a ground layer and a power layer, the power layer being insulated from the ground layer;
- a solder pad array disposed on the first surface, wherein the solder pad array includes a plurality of power solder pads electrically connected to the power layer and a plurality of ground solder pads electrically connected to the ground layer, the power solder pads and the ground solder pads are arranged in a first predetermined region of the first surface, a portion of the ground solder pads and a portion of the power solder pads are arranged in an alternate manner;
- and
- a plurality of contact pad sets disposed on the second surface, wherein each of the contact pad sets includes an anode contact pad and a cathode contact pad;
- and
- a control device disposed on the circuit board and including a ball pad array disposed at a bottom thereof, wherein the control device is electrically connected to the circuit board by connecting the ball pad array to the solder pad array, the ball pad array includes a plurality of power ball pads and a plurality of ground ball pads, the power ball pads and the ground ball pads are arranged in the same pad arrangement region, and at least a portion of the ground ball pads and at least a portion of the power ball pads are arranged in an alternate manner;
- a plurality of passive elements disposed on the circuit board respectively through the contact pad sets, wherein each of the passive elements and the control device are respectively located at two opposite sides of the laminated board.
Dependencies are inferred from the claim text.