Lead frame
AssigneeOhkuchi Materials Co., Ltd.
InventorsKaoru Hishiki, Keiichi Otaki, Hidehiko Sasaki, Kotaro Tomeoka
Life of this patent
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Abstract
A lead frame includes, as an outermost plating layer, a roughened silver plating layer having acicular projections and covering the entire surface of a lead frame substrate made of a copper-based material. The roughened silver plating layer has a crystal structure in which the crystal direction <101> occupies a largest proportion among the crystal directions <001>, <111>, and <101>. The lead frame can be manufactured with improved productivity owing to reduction in cost and operation time, and achieves remarkably high adhesion to sealing resin while keeping the total thickness of plating layers including the silver plating layer to be thin.
Claims4
A lead frame comprising:
- a lead frame substrate made of a copper-based material;
- and
- a roughened silver plating layer having acicular projections, provided as an outermost plating layer and covering an entire surface of the lead frame substrate,
- wherein the roughened silver plating layer has a crystal structure in which the crystal direction <101> occupies a largest proportion among the crystal directions <001>, <111> and <101>, and
- wherein the acicular projections included in the roughened silver plating layer have a surface area ratio, which is a ratio of a surface area of the roughened silver plating layer to a surface area of a corresponding smooth surface, of 1.30 or more and 6.00 or less.
Dependencies are inferred from the claim text.