US 10,763,194 B2Granted

Package with lead frame with improved lead design for discrete electrical components and manufacturing the same

AssigneesSTMicroelectronics S.r.l., Stmicroelectronics Pte Ltd

InventorsRennier Rodriguez, Bryan Christian Bacquian, Maiden Grace Maming, David Gani

Life of this patent

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Abstract

A semiconductor package includes a lead frame, a die, a discrete electrical component, and electrical connections. The lead frame includes leads and a die pad. Some of the leads include engraved regions that have recesses therein and the die pad may include an engraved region or multiple engraved regions. Each engraved region is formed to contain and confine a conductive adhesive from flowing over the edges of the engraved leads or the die pad. The boundary confines the conductive adhesive to the appropriate location on the engraved lead or the engraved die pad when being placed on the engraved regions. By utilizing a lead frame with engraved regions, the flow of the conductive adhesive or the wettability of the conductive adhesive can be contained and confined to the appropriate areas of the engraved lead or engraved die pad such that a conductive adhesive does not cause cross-talk between electrical components within a semiconductor package or short circuiting within a semiconductor package.

Claims20

Dependent claims

A semiconductor package, comprising:

a lead frame having a first side and a second side, the lead frame including:
an engraved lead having a first engraved region on the first side of the lead frame, the first engraved region including:
a first recess extending into the first side of the engraved lead toward the second side of the engraved lead, the first recess having a first end located within the engraved lead;
and
a first high region that is surrounded by the first recess, a surface of the first high region being spaced from the first end of the first recess;
a die pad having a second engraved region on the first side, the second engraved region including:
a second recess extending into the first side of the die pad toward the second side of the die pad, the second recess having a second end located within the die pad;
and
a second high region that is surrounded by the second recess, a surface of the second high region being spaced from the second end of the second recess;
a discrete electrical component having a first end electrically and physically coupled to the first high region and a second end electrically and physically coupled to the second high region;
a die electrically and physically coupled to the first side of the die pad, the die being spaced from the discrete electrical component;
and
a molding compound encasing the lead frame, the die, and the discrete electrical component.

10 more elements

A semiconductor package, comprising:

a lead frame having a first surface and a second surface, the first surface facing away from the second surface, the lead frame including:
a plurality of engraved leads, each engraved lead having a first engraved region and a first height between the first surface and the second surface, the first engraved region including a hill and a trough, the trough being adjacent to and surrounding the hill, the trough extending into the first surface a second height toward the second surface, the second height being less than the first height;
a die pad having a second engraved region and the first height, the second engraved region including a hill and a trough, the trough being adjacent to and surrounding the hill, the trough extending into the first surface of the lead frame by a third height toward the second surface of the lead, the third height being less than the first height;
a first discrete electrical component electrically and physically coupled between a first hill and a second hill of the plurality of engraved leads;
a second discrete electrical component electrically and physically coupled between a third hill of the plurality of engraved leads and a fourth hill of the second engraved region of the die pad;
a die electrically and physically coupled to the first surface of the die pad, the die being spaced from the first discrete electrical component and the second discrete electrical component;
and
a molding compound encasing the lead frame, the first and second discrete electrical components, and the die.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/713,389Filed 22 Sep 2017
Published: US 2019/0096788 A128 Mar 2019
Granted: 1 Sep 2020
Term ends: Not estimatedThe source records don’t support an estimate.

Classification30 codes

H10W 70/421
Leadframes: shapes or dispositions
H10P 54/00
Cutting or separating of wafers, substrates or parts of devices
H10P 72/7402
Using temporarily an auxiliary support: wafer tapes, e.g. grinding or dicing support tapes
H10W 70/041
Of leadframes: connecting or disconnecting interconnections to or from leadframes, e.g. connecting bond wires or bumps