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US 10,763,192 B2Granted
Method of manufacturing semiconductor devices and corresponding semiconductor device
AssigneeSTMicroelectronics S.r.l.
InventorDario Vitello
Life of this patent
Estimating the term…
Abstract
A method of attaching a semiconductor die or chip onto a support member such as a leadframe comprises: applying onto the support member at least one stretch of ribbon electrical bonding material and coupling the ribbon material to the support member, arranging at least one semiconductor die onto the ribbon material with the ribbon material between the support member and the semiconductor die, coupling the semiconductor die to the ribbon material.
Claims17
A method, comprising:
- applying onto a surface of a semiconductor die support member a conductive ribbon and coupling the conductive ribbon to the support member,
- arranging a semiconductor die onto the conductive ribbon with the conductive ribbon between the support member and the semiconductor die, and
- affixing the semiconductor die to the conductive ribbon, wherein:
- the coupling the conductive ribbon to the support member comprises attaching the conductive ribbon to the support member at a plurality of attachment points with one or more bridge-like sections extending between the attachment points without contacting the surface of the support member;
- and
- the affixing the semiconductor die to the conductive ribbon comprises applying attachment energy to the semiconductor die and the support member with the one or more bridge-like sections of the conductive ribbon arranged therebetween.
3 more elements
A semiconductor device, comprising:
- a semiconductor die support member,
- a plurality of ribbons of electrical bonding material, including a first ribbon of electrical bonding material positioned on and coupled to the support member, the ribbons extending lengthwise along a length of the semiconductor die and being spaced apart from each other and arranged across a width of the semiconductor die;
- and
- a semiconductor die arranged onto the first ribbon with the first ribbon between the support member and the semiconductor die, with the semiconductor die fixed to the electrical bonding material of the first ribbon.
1 more element
A method, comprising:
- attaching a first ribbon of electrical bonding material to a conductive support member at a plurality of attachment points with one or more bridge-like sections extending between the attachment points without contacting the surface of the support member;
- arranging a semiconductor die onto the first ribbon, with the one or more bridge-like sections of the first ribbon being between the support member and the semiconductor die;
- and
- affixing the semiconductor die to the first ribbon, the affixing including affixing applying attachment energy to at least one of the semiconductor die and first ribbon.
1 more element
Dependencies are inferred from the claim text.