Dual in-line memory module (DIMM) Edgewater Spring (EWS) multi point contact cooling jacket
AssigneeHewlett Packard Enterprise Development LP
InventorsJohn Franz, Harvey Lunsman, Steven Dean
Life of this patent
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AssigneeHewlett Packard Enterprise Development LP
InventorsJohn Franz, Harvey Lunsman, Steven Dean
Estimating the term…
Systems and apparatus are provided for thermal cooling of integrated circuits, such as dual in-line memory modules (DIMMs). The apparatus includes a plurality of rows pieces that include individual leaf springs. Each of the leaf springs can exert compression to support thermal contact and a stable coupling with a received DIMM. The plurality of row pieces can be assembled to form a single structure, having a space to receive an individual DIMM for insertion. Further, each of the leaf springs are structured to allow a portion of its surface, having a conductive material disposed thereon, to support transfer of heat away from the DIMM at a point of thermal contact. The apparatus can be coupled to a printed circuit assembly (PCA) having additional cooling mechanisms installed thereon, in a manner that allows the additional cooling mechanisms to be integrated with the apparatus and provide increased thermal cooling for the DIMMs.
An apparatus, comprising:
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Dependencies are inferred from the claim text.