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US 10,763,188 B2Granted
Integrated heat spreader having electromagnetically-formed features
AssigneeIntel Corporation
InventorsAravindha R. Antoniswamy, Thomas John Fitzgerald, Kumaran Murugesan Chakravarthy, Syadwad Jain, Wei Hu, Zhizhong Tang
Life of this patent
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Abstract
Integrated heat spreaders having electromagnetically-formed features, and semiconductor packages incorporating such integrated heat spreaders, are described. In an example, an integrated heat spreader includes a top plate flattened using an electromagnetic forming process. Methods of manufacturing integrated heat spreaders having electromagnetically-formed features are also described.
Claims4
An integrated heat spreader, comprising:
- a top wall including a first portion having a first thickness and a second portion having a second thickness at least 20% greater than the first thickness, wherein the top wall has a plurality of microstructure dislocations, and wherein an average dislocation density of the first portion is less than an average dislocation density of the second portion;
- and
- a side wall contiguously coupled to the top wall along a peripheral bend.
Dependencies are inferred from the claim text.