Package cooling by coil cavity
AssigneeMicron Technology, Inc.
InventorsAndrew M. Bayless, Wayne H. Huang, Owen R. Fay
Life of this patent
Estimating the term…
Abstract
A semiconductor device assembly can include a first die package comprising a bottom side; a top side; and lateral sides extending between the top and bottom sides. The assembly can include an encapsulant material encapsulating the first die package. In some embodiments, the assembly includes a cooling cavity in the encapsulant material. The cooling cavity can have a first opening; a second opening; and an elongate channel extending from the first opening to the second opening. In some embodiments, the elongate channel surrounds at least two of the lateral sides of the first die package. In some embodiments, the elongate channel is configured to accommodate a cooling fluid.
Claims31
A method of manufacturing a semiconductor device, the method comprising:
- surrounding at least two sides of a die package with a sacrificial member;
- encapsulating the die package and sacrificial member in an encapsulant material;
- and
- removing the sacrificial member via chemically etching, melting, dissolving, vaporizing, and/or shattering the sacrificial member.
A semiconductor device assembly comprising:
- a first die package comprising:
- a bottom side;
- a top side;
- and
- lateral sides extending between the top and bottom sides;
- an encapsulant material encapsulating the first die package;
- and
- a cooling cavity in the encapsulant material, the cooling cavity comprising:
- a first opening;
- a second opening;
- and
- an elongate channel extending from the first opening to the second opening;
- wherein:
- the elongate channel surrounds at least two of the lateral sides of the first die package;
- the elongate channel is configured to accommodate a cooling fluid;
- and
- wherein the first opening and the second opening are the only openings of the cooling cavity, and wherein the elongate channel of the cooling cavity is a single channel between the first opening and the second opening without splits, forks, and dead ends.
A semiconductor device assembly comprising:
- a first die package comprising:
- a bottom side;
- a top side;
- and
- lateral sides extending between the top and bottom sides;
- an encapsulant material encapsulating the first die package;
- and
- a cooling cavity in the encapsulant material, the cooling cavity comprising:
- a first opening;
- a second opening;
- and
- an elongate channel extending from the first opening to the second opening;
- wherein:
- the elongate channel surrounds at least two of the lateral sides of the first die package;
- the elongate channel is configured to accommodate a cooling fluid;
- and
- wherein the elongate channel has a helical shape or serpentine shape surrounding all lateral sides of the first die package.
Dependencies are inferred from the claim text.