Power module substrate, power module, and method for manufacturing power module substrate
AssigneeKYOCERA Corporation
InventorsKenji Suetsugu, Akira Takeo, Kensou Ochiai
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Abstract
A power module substrate or the like including an insulating substrate with an upper surface and a lower surface, a metal plate with an upper surface and a lower surface, the lower surface facing and being bonded to the upper surface of the insulating substrate, and a first electroplating layer that partly covers the central portion of the upper surface of the metal plate. The first electroplating layer includes at least a silver layer, and the grain size of silver in the silver layer is more than or equal to the grain size of a metal in an upper surface portion of the metal plate.
Claims18
A power module substrate comprising:
- an insulating substrate with an upper surface and a lower surface;
- a metal plate with an upper surface and a lower surface, the lower surface facing and being bonded to the upper surface of the insulating substrate;
- and
- a first electroplating layer on part of a central portion of the upper surface of the metal plate,
- wherein the first electroplating layer comprises at least a silver layer, and
- a grain size of silver in the silver layer is more than or equal to a grain size of a metal in an upper surface portion of the metal plate.
Dependencies are inferred from the claim text.