Semiconductor device
AssigneeMitsubishi Electric Corporation
InventorsNaohiro Ogushi, Koichi Taguchi
Life of this patent
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Abstract
A case (6) surrounds a semiconductor chip (5). A case electrode (7) is attached to an upper face of the case (6). A wire (8) is connected to the semiconductor chip (5) and the case electrode (7). A first holding portion (10) presses down the case electrode (7) on the upper face of the case (6) outside a joint portion where the wire (8) is bonded to the case electrode (7). A second holding portion (11) presses down the case electrode (7) on the upper face of the case (6) inside the joint portion. A recess (12) is formed on the upper face of the case (6). The case electrode (7) is bent such as to fit into the recess (12). The second holding portion (11) is disposed inside the recess (12).
Claims16
A semiconductor device comprising:
- a semiconductor chip;
- a case surrounding the semiconductor chip;
- a case electrode attached to an upper face of the case;
- a wire connected to the semiconductor chip and the case electrode;
- a first holding portion pressing down the case electrode on the upper face of the case outside a joint portion where the wire is bonded to the case electrode;
- and
- a second holding portion pressing down the case electrode on the upper face of the case inside the joint portion,
- wherein a recess is formed on the upper face of the case,
- the case electrode is bent such as to fit into the recess, and
- the second holding portion is disposed inside the recess.
A semiconductor device comprising:
- a semiconductor chip;
- a case surrounding the semiconductor chip;
- a case electrode attached to an upper face of the case;
- a wire connected to the semiconductor chip and the case electrode;
- a first holding portion pressing down the case electrode on the upper face of the case outside a joint portion where the wire is bonded to the case electrode;
- and
- a second holding portion pressing down the case electrode on the upper face of the case inside the joint portion,
- wherein a recess is formed on the upper face of the case, and
- the second holding portion is disposed inside the recess.
A semiconductor device comprising:
- a semiconductor chip;
- a case surrounding the semiconductor chip;
- a case electrode attached to an upper face of the case;
- and
- a wire connected to the semiconductor chip and the case electrode,
- wherein a recess is formed on a side face of the case electrode, and
- the case electrode is fixed to the case with case resin filled in the recess.
A semiconductor device comprising:
- a semiconductor chip;
- a case surrounding the semiconductor chip;
- a case electrode attached to an upper face of the case;
- a wire connected to the semiconductor chip and the case electrode;
- a first holding portion pressing down the case electrode on the upper face of the case outside a joint portion where the wire is bonded to the case electrode;
- and
- a second holding portion pressing down the case electrode on the upper face of the case inside the joint portion,
- wherein the second holding portion is tapered along the wire.
A semiconductor device comprising:
- a semiconductor chip;
- a case surrounding the semiconductor chip;
- a case electrode attached to an upper face of the case;
- a wire connected to the semiconductor chip and the case electrode;
- a first holding portion pressing down the case electrode on the upper face of the case outside a joint portion where the wire is bonded to the case electrode;
- and
- a second holding portion pressing down the case electrode on the upper face of the case inside the joint portion,
- wherein the second holding portion is adhesive.
Dependencies are inferred from the claim text.