Thin semiconductor package and related methods

A method of forming a semiconductor package comprising:

• forming a plurality of notches into a first side of a wafer, the first side of the wafer comprising a plurality of electrical contacts;
• coating the first side of the wafer and an interior of the plurality of notches with a molding compound;
• forming a back metal on a second side of the wafer;
• exposing the plurality of electrical contacts through thinning a first side of the molding compound;
• and
• singulating the wafer at the plurality of notches to form a plurality of semiconductor packages.

A method of forming a semiconductor package comprising:

• forming a plurality of notches into a second side of a wafer opposite a first side of a wafer, the first side of the wafer comprising a plurality of electrical contacts;
• coating the first side of the wafer with a first molding compound;
• coating the second side of the wafer with a second molding compound;
• exposing the plurality of electrical contacts through thinning a first side of the first molding compound;
• and
• singulating the wafer along the plurality of notches forming a plurality of semiconductor packages.