Method of processing wafer

A method of processing a wafer having a face side where devices are formed in respective areas demarcated by a grid of projected dicing lines, comprising the steps of:

• forming grooves in the wafer to a depth exceeding a finished thickness of the wafer along the projected dicing lines;
• covering the face side of the wafer with a protective film in intimate contact with the face side including the grooves;
• producing a protective-member-combined wafer that includes the wafer whose face side is covered with the protective film and a protective member formed by pressing the protective film onto a flat sheet and curing a liquid resin applied to the flat sheet, wherein the liquid resin is curable by an external stimulus, such that the liquid resin forms the protective member;
• holding the protective member of the protective-member-combined wafer on a chuck table, grinding a reverse side of the protective-member-combined wafer to thin the protective-member-combined wafer to the finished thickness, thereby exposing the grooves on the reverse side to divide the protective-member-combined wafer into a plurality of device chips;
• bonding a die-attach film held on a dicing tape to the reverse side of the protective-member-combined wafer that has been divided into the device chips;
• holding the dicing tape bonded to the protective-member-combined wafer where the device chips are kept in their layouts by the protective member, under suction on a chuck table of a laser processing apparatus;
• peeling off the protective film and the protective member from the face side of the protective-member-combined wafer while the device chips are being kept in their layouts by the protective-member-combined wafer held under suction on the chuck table;
• and
• applying a laser beam having a wavelength absorbable by the die-attach film to portions of the die-attach film that are exposed between the device chips, while the device chips are being kept in their layouts by the wafer being held under suction on the chuck table, thereby dividing the die-attach film along the projected dicing lines.