Conductive powder formation method, device for forming conductive powder, and method of forming semiconductor device
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYou-Hua Chou, Kuo-Sheng Chuang
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Abstract
A method of forming a conductive powder includes reducing, by a reduction reaction, a conductive powder precursor gas using a plasma. Reducing the conductive powder precursor gas forms the conductive powder. The method further includes filtering the conductive powder based on particle size. The method further includes dispersing a portion of the conductive powder having a particle size below a threshold value in a fluid.
Claims20
A method of forming a semiconductor device, the method comprising:
- forming at least one opening in a dielectric material;
- depositing a graphene layer in the at least one opening;
- filling the at least one opening with a conductive powder dispersed in a fluid, wherein the fluid comprises at least one of methane, isopropyl alcohol, acetone, or ethyl acetate;
- and
- melting the conductive powder.
A method of forming a semiconductor device, the method comprising:
- forming at least one opening in a dielectric material;
- depositing a graphene layer in the at least one opening;
- reducing, by a reduction reaction, a conductive powder precursor gas using a plasma to form a conductive powder;
- preheating the conductive powder precursor gas prior to the reducing the conductive powder precursor gas;
- filtering the conductive powder based on particle size;
- and
- dispersing a portion of the conductive powder having a particle size below a threshold value in a fluid;
- filling the at least one opening with the conductive powder dispersed in the fluid;
- and
- melting the conductive powder.
A method of forming a semiconductor device, the method comprising:
- reducing, by a reduction reaction, a conductive powder precursor gas using a plasma to form the conductive powder;
- filtering the conductive powder based on particle size using at least one of an electro-static collector (ESC) process or a centrifugal process;
- dispersing a portion of the conductive powder having a particle size below a threshold value in a fluid;
- filling at least one opening in a dielectric material with the conductive powder dispersed in the fluid;
- removing the fluid from the at least one opening by evaporation;
- and
- melting the conductive powder following removal of the fluid.
Dependencies are inferred from the claim text.