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US 10,763,151 B2Granted
Wafer carrier, method for manufacturing the same and method for carrying a wafer
AssigneeInfineon Technologies AG
InventorsFrancisco Javier Santos Rodriguez, Roland Rupp, Ronny Kern, Josef Unterweger
Life of this patent
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Abstract
A wafer carrier comprises a first foil, a second foil, and a chamber between the first and the second foil. The first foil has a perforation and is used for carrying the wafer. The first and the second foil are connected to each other so as to form the chamber. The chamber is configured to be evacuated to form a vacuum in the chamber, the vacuum causes an underpressure at the perforation, the underpressure forms a carrying force to the wafer to be carried.
Claims18
A wafer carrier comprising:
- a first foil comprising a perforation and configured to carry a wafer;
- a second foil;
- and
- a chamber between the first foil and the second foil, wherein the first foil and the second foil are connected to each other so as to form the chamber,
- wherein the chamber is configured to be evacuated to form a vacuum in the chamber so that the vacuum causes an underpressure at the perforation to provide a carrying force to the wafer, and
- wherein the first and second foils are connected to each other using a common edge surrounding the chamber.
3 more elements
A wafer carrier comprising:
- a first foil comprising a perforation and configured to carry a wafer;
- a second foil;
- and
- a chamber between the first foil and the second foil, wherein the first foil and the second foil are connected to each other so as to form the chamber,
- wherein the chamber is configured to be evacuated to form a vacuum in the chamber so that the vacuum causes an underpressure at the perforation, the underpressure configured to hold a wafer directly on the perforation, and
- wherein the first and second foils are connected to each other using a common edge surrounding the chamber.
3 more elements
A wafer carrier comprising:
- a first foil comprising a perforation and configured to carry a wafer;
- a second foil;
- and
- a chamber between the first foil and the second foil, wherein the first foil and the second foil are connected to each other so as to form the chamber,
- wherein the chamber is configured to be evacuated to form a vacuum in the chamber so that the vacuum causes an underpressure configured to hold a wafer without an adhesive on the first foil, and
- wherein the first and second foils are connected to each other using a common edge surrounding the chamber.
3 more elements
Dependencies are inferred from the claim text.