System for coupling a voltage to spatially segmented portions of the wafer with variable voltage

A substrate support assembly, comprising:

• a substrate support;
• a plurality of bias electrodes embedded in the substrate support;
• a pair of switches, wherein each bias electrode of the plurality of bias electrodes is electrically connected to the pair of switches;
• at least one trim voltage source electrically and physically connected between the pair of switches and at least one of the bias electrodes of the plurality bias of electrodes;
• and
• a chucking electrode planarly embedded in the substrate support.

A processing chamber, comprising:

• a chamber lid;
• one or more sidewalls;
• a chamber bottom, wherein the chamber lid, the one or more sidewalls, and the chamber bottom define a processing volume;
• and
• a substrate support assembly disposed in the processing volume, the substrate support assembly comprising;
• a cooling base;
• a substrate support coupled to the cooling base;
• a chucking electrode planarly embedded in the substrate support;
• a plurality of bias electrodes embedded in the substrate support;
• a pair of switches, wherein at least one bias electrode of the plurality of bias electrodes is electrically connected to the pair of switches;
• and
• at least one trim voltage source electrically and physically connected between the pair of switches and at least one of the bias electrodes.