Semiconductor manufacturing equipment and semiconductor manufacturing method

A semiconductor manufacturing method, comprising the steps of:

• preparing semiconductor manufacturing equipment including a rotation mechanism configured to rotate a wafer including an etched region, which is to be etched at least partially, an etching mechanism configured to etch the etched region, a thickness measurement function configured to generate time-dependent thickness data by measuring a thickness of the etched region, an etching control function configured to stop the etching mechanism when a representative value of thickness of the etched region reaches a target thickness value, and a thickness calculation function configured to calculate the representative value of thickness for each unit period in which the wafer is rotated N times, where N is a natural number, based on measurement values of the time-dependent thickness data in a measurement section being a range measured during the unit period;
• and
• processing the wafer by using the semiconductor manufacturing equipment.