Integrated elastomeric interface layer formation and singulation for light emitting diodes
AssigneeFacebook Technologies, LLC
InventorsPooya Saketi, Karsten Moh, Tilman Zehender
Life of this patent
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Abstract
Embodiments relate to an integrated process for forming an elastomeric layer over an epitaxial structure of multiple light emitting diode (LED) dies, and then etching the elastomeric layer into individual elastomeric interface layers (elayers) on each of the LED dies and etching the epitaxial structure to singulate the LED dies. The elayer allows each LED die to be picked up by a pick-up head (or pick and place head (PPH)), and placed onto a display substrate including control circuits for sub-pixels of an electronic display. In some embodiments, the LED dies are micro-LED (uLED) dies.
Claims20
A method, comprising:
- forming one or more layers on a first surface of an epitaxial structure, first portions of the epitaxial structure defining an array of light emitting diode (LED) dies, at least a subset of the first portions placed between second portions of the epitaxial structure, a second surface of the epitaxial structure facing a carrier substrate, wherein forming the one or more layers on the first surface of the epitaxial structure comprises:
- forming an elastomeric layer over the first surface of the epitaxial structure;
- and
- forming a metallic layer over the elastomeric layer;
- and
- singulating the one or more layers and the epitaxial structure into individual LED dies by selectively etching the second portions of the epitaxial structure and portions of the one or more layers over the second portions of the epitaxial structure.
A light emitting diode (LED) die manufactured by a process, comprising:
- forming one or more layers on a first surface of an epitaxial structure, a first portion of the epitaxial structure defining a light emitting diode (LED) die, at least a portion of the first portion placed between second portions of the epitaxial structure, a second surface of the epitaxial structure facing a carrier substrate, wherein forming the one or more layers on the first surface of the epitaxial structure comprises:
- forming an elastomeric layer over the first surface of the epitaxial structure;
- and
- forming a metallic layer over the elastomeric layer;
- and
- singulating the one or more layers and the epitaxial structure into an individual LED die by selectively etching the second portions of the epitaxial structure and portions of the one or more layers over the second portions of the epitaxial structure.
Dependencies are inferred from the claim text.