Semiconductor structure and semiconductor package device using the same
AssigneeAdvanpack Solutions Pte Ltd.
InventorsJimmy Hwee-Seng Chew, Kian-Hock Lim, Oviso Dominador Jr. Fortaleza, Shoa-Siong Lim
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Abstract
A semiconductor structure for manufacturing a semiconductor package device is provided. The semiconductor structure includes a carrier and a dielectric layer. The carrier has a first surface and a second surface opposite to the first surface. The carrier includes an inner core layer and an exterior clad layer, and the inner core layer is covered by the exterior clad layer. The dielectric layer is formed on the first surface of the carrier. The carrier supports the dielectric layer.
Claims10
A semiconductor structure for preventing damage to a trace wiring layer of a semiconductor package device during manufacturing, comprising:
- a carrier, being used as a support during the manufacturing of the semiconductor package device, comprising an inner core layer and an exterior clad layer, wherein the exterior clad layer covers the inner core layer to form a first carrier surface and a second carrier surface opposite to the first carrier surface;
- wherein during the manufacturing, the semiconductor package device includes a dielectric layer and a trace wiring layer, the dielectric layer having a first dielectric surface adjacent to the first carrier surface and a second dielectric surface opposite the first dielectric surface, and the trace wiring layer is embedded between the first and second dielectric surface and electrically connecting the first carrier surface to the second dielectric surface;
- wherein the inner core layer and the exterior clad layer are of different materials such that the exterior clad layer has a lower etch rate than the inner core layer.
Dependencies are inferred from the claim text.