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US 10,763,132 B2Granted
Release film as isolation film in package
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJing-Cheng Lin, Li-Hui Cheng, Po-Hao Tsai
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Abstract
A method includes forming a release film over a carrier, attaching a device over the release film through a die-attach film, encapsulating the device in an encapsulating material, performing a planarization on the encapsulating material to expose the device, detaching the device and the encapsulating material from the carrier, etching the die-attach film to expose a back surface of the device, and applying a thermal conductive material on the back surface of the device.
Claims19
A method comprising:
- forming a plurality of conductive posts on a substrate;
- temporarily attaching a backside of an integrated circuit device to the substrate using an adhesive layer;
- encapsulating the plurality of conductive posts and the integrated circuit device in an encapsulant;
- planarizing the encapsulant to expose electrical connections on a front side of the integrated circuit device and to expose the conductive posts;
- forming a circuit electrically coupled to the electrical connections of the integrated circuit device and extending at least partially over a first major surface of the encapsulant;
- after forming the circuit, removing the integrated circuit device, the conductive posts and the encapsulant from the substrate;
- and
- after removing the integrated circuit device, the conductive posts and the encapsulant from the substrate, etching the adhesive layer from the backside of the integrated circuit device to form a trench in the encapsulant, wherein a sidewall of the integrated circuit device is exposed to the trench.
5 more elements
A method comprising:
- forming a metal post over a substrate;
- attaching a device die over the substrate through a die-attach film;
- encapsulating the device die and the metal post in an encapsulating material;
- removing the substrate from the encapsulating material, the device die, and the metal post;
- performing a dry etching process to remove a portion of the die-attach film to reveal a back surface of the device die;
- bonding a package to the metal post;
- filling a gap between the device die and the package with a thermally conductive material, wherein the thermally conductive material comprises a thermally conductive paste, and the thermally conductive paste comprises an adhesive and metal particles mixed in the adhesive;
- wherein the thermally conductive paste comprises a portion extending into the encapsulating material, and the portion comprises a sidewall contacting a sidewall of the device die.
5 more elements
A package comprising:
- an encapsulating material;
- a conductive pillar extending through the encapsulating material;
- a device encapsulated in the encapsulating material, wherein the device comprises a semiconductor substrate with a back surface;
- a redistribution layer electrically connecting the conductive pillar and the device;
- a package component over and bonded to the conductive pillar;
- and
- an underfill between the encapsulating material and the package component, wherein the underfill is in contact with the encapsulating material, and a portion of the underfill extends into the encapsulating material.
4 more elements
Dependencies are inferred from the claim text.