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US 10,763,131 B2Granted
Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods
AssigneeMicron Technology, Inc.
InventorsShijian Luo, Jonathan S. Hacker
Life of this patent
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Abstract
A semiconductor device includes a substrate including traces, wherein the traces protrude above a top surface of the substrate; a prefill material over the substrate and between the traces, wherein the prefill material directly contacts peripheral surfaces of the traces; a die attached over the substrate; and a wafer-level underfill between the prefill material and the die.
Claims16
A semiconductor device, comprising:
- a substrate including traces, wherein the traces protrude above a top surface of the substrate;
- a prefill material over the substrate and between the traces, wherein:
- the prefill material directly contacts peripheral surfaces of the traces,
- the prefill material corresponds to a first viscosity level for a manufacturing condition,
- the prefill material includes a nonconductive liquid encapsulant;
- a die attached over the substrate;
- and
- a wafer-level underfill between the prefill material and the die, the wafer-level underfill corresponding to a second viscosity level for the manufacturing condition;
- wherein:
- the first viscosity level is lower than the second viscosity level;
- and
- the prefill material includes solder mask with a top surface that is coplanar with or below one or more top surfaces of the traces located between peripheral edges of the die.
9 more elements
A method of manufacturing a semiconductor device, comprising:
- providing a substrate including traces, wherein the traces protrude above a top surface of the substrate;
- forming a prefill material over the substrate and between the traces based on jetting a nonconductive liquid encapsulant between the traces, wherein
- the prefill material directly contacts peripheral surfaces of the traces;
- and
- jetting the nonconductive liquid encapsulant includes jetting the nonconductive liquid encapsulant with a top surface thereof coplanar with or below top surfaces of one or more of the traces located between peripheral edges of the die;
- and
- attaching an interim structure to the substrate over the prefill material, wherein the interim structure includes a die and a wafer-level underfill between the die and the prefill material.
4 more elements
Dependencies are inferred from the claim text.