Systems and methods for improved delamination characteristics in a semiconductor package

A system for manufacturing an integrated circuit device, the system comprising:

• an automated loading machine configured to position a lead frame on an automated machine feeder, the lead frame including a die support area and a plurality of leads;
• the automated machine feeder configured to deliver the lead frame to an automated epoxy dispensing machine and to an automated die attach machine;
• wherein the epoxy dispensing machine is configured to deposit epoxy on at least a portion of the die support area of the lead frame;
• wherein the die attach machine includes:
• an automated die attach heater configured to apply heat to at least the epoxy to a temperature of 55° C.±15° C. to achieve additional cross-linking in an epoxy reaction and reduce outgassing from the epoxy, in comparison to mounting the integrated circuit chip without heating the epoxy to the temperature of 55° C.±15° C.;
• and
• an automated mounting device configured to mount an integrated circuit chip over the epoxy-covered die support area while the epoxy is at the heated temperature of 55° C.±15° C.

A method for manufacturing an integrated circuit device including an integrated circuit chip mounted on a die support area of a lead frame, the method comprising:

• performing, by an automated die attach machine, an automated die attach process to form an integrated circuit structure, the automated die attach process including:
• using an automated feeding device to carry the lead frame to an automated epoxy dispensing machine;
• depositing epoxy, by the automated epoxy dispensing machine, on at least a portion of the die support area of the lead frame;
• using the automated feeding device to carry the lead frame with the deposited epoxy to an automated chip mounting device having an associated heater;
• using the heater associated with the automated chip mounting device to heat the epoxy on the die support area of the lead frame to a temperature of 55° C.±15° C. and while the epoxy is at the heated temperature of 55° C.±15° C., using the automated chip mounting device of the automated die attach machine to mount the integrated circuit chip over the epoxy-covered die support area such that a portion of the epoxy extends laterally outside of an outer perimeter of the integrated circuit chip, wherein the heating of the epoxy to the heated temperature of 55° C.±15 achieves additional cross-linking in an epoxy reaction and reduces outgassing from the epoxy, in comparison to performing the automated mounting step without heating the epoxy to the temperature of 55° C.±15° C.;
• after the die attach process, performing a die attach cure process on the integrated circuit structure;
• performing a wire bond process to bond at least one wire to the integrated circuit structure;
• and
• applying a molding material to at least partially encapsulate the integrated circuit structure.