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US 10,763,129 B2Granted
System and method for laser assisted bonding of an electronic device
AssigneeAmkor Technology, Inc.
InventorsTae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim
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Abstract
A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.
Claims15
A method of manufacturing an electronic device, the method comprising:
- receiving a first electronic component having a laser assisted bonding (LAB) material thereon;
- receiving a second electronic component;
- positioning the first and second electronic components such that a plurality of interconnection structures are positioned between the first and second electronic components;
- and
- laser-irradiating at least a portion of the LAB material while reflowing the interconnection structures.
2 more elements
A method of manufacturing an electronic device, the method comprising:
- receiving a first structure comprising:
- a first electronic component;
- a second electronic component;
- a plurality of interconnection structures between the first and second electronic components;
- and
- a laser assisted bonding (LAB) material on the first electronic component;
- and
- laser-irradiating at least a portion of the first structure while reflowing the interconnection structures.
5 more elements
Dependencies are inferred from the claim text.