Etching apparatus and etching method
AssigneeTokyo Electron Limited
InventorsKoichi Nagami, Kazuya Nagaseki
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Abstract
An etching apparatus includes: a placement table serving as a lower electrode and configured to place a workpiece to be subjected to an etching processing thereon; a DC power supply configured to generate a negative DC voltage applied to the placement table; and a controller configured to: periodically apply a negative DC voltage to the placement table from the DC power supply when the etching processing on the workpiece placed on the placement table is initiated, and decrease a frequency of the negative DC voltage applied to the placement table with an elapse of processing time of the etching processing.
Claims8
An etching apparatus comprising:
- a placement table serving as a lower electrode and configured to place a workpiece to be subjected to an etching processing thereon;
- a DC power supply configured to generate a negative DC voltage applied to the placement table;
- and
- a controller configured to:
- periodically apply a negative DC voltage to the placement table from the DC power supply when the etching processing on the workpiece placed on the placement table is initiated;
- and decrease a frequency of the negative DC voltage applied to the placement table with an elapse of processing time of the etching processing.
An etching method comprising:
- periodically applying a negative DC voltage to a placement table serving as a lower electrode and configured to place a workpiece thereon from a DC power supply configured to generate the negative DC voltage applied to the placement table when an etching processing is initiated on the workpiece placed on the placement table;
- and
- decreasing a frequency of the negative DC voltage applied to the placement table from the DC power supply with an elapse of processing time of the etching processing.
Dependencies are inferred from the claim text.