# US 10,763,082 B2 · Chamber of plasma system, liner for plasma system and method for installing liner to plasma system > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,763,082 B2 - Document ID: US10763082B2 - Status: Granted - Kind: B2 - Application number: 15/060,608 - Filed: 2016-03-04 - Published: 2017-09-07 - Granted: 2020-09-01 - Earliest claimed: 2016-03-04 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Co., Ltd. - Inventors: Chung-Hsien Liao; Wen-Pao Tsai - Web page: https://patentgrep.com/patent/US10763082B2 ## CPC - H01J 37/32431: {Constructional details of the reactor} - H01J 37/32082: {Radio frequency generated discharge (H01J37/32357, H01J37/32366, H01J37/32394 and H01J37/32403 take precedence)} - H01J 37/32467: {Material} - H01J 37/32477: {characterised by the means for protecting vessels or internal parts, e.g. coatings} - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) ## Abstract A chamber of a plasma system includes a chamber wall defining a plasma processing area, a substrate supporter configured to support a substrate in the plasma processing area, and a liner located in the plasma processing area and separating the chamber wall from the plasma processing area. A liner for a plasma system and a method for installing a liner to a plasma system are also provided. ## Claims ### Claim 1 A chamber of a plasma system, comprising: a lower chamber and an upper chamber defining a plasma processing area; a substrate supporter configured to support a substrate in the plasma processing area; and a liner located in the lower chamber and separating a chamber wall from the plasma processing area, wherein the liner has a side wall and a plurality of bottom tabs, the side wall is a ring surrounding along an inner sidewall of the lower chamber, the plurality of bottom tabs is connected to and extend from a bottom of the side wall toward the substrate supporter, the plurality of bottom tabs are spaced from each other, the liner is fixed to a bottom surface of the chamber wall in the lower chamber by screwing a plurality of first screws through the plurality of bottom tabs, and a topmost surface of the liner is lower than a topmost surface of the lower chamber. ### Claim 2 (depends on 1) The chamber of claim 1, wherein the liner comprises a liner body and an insulating protective layer covering the liner body. ### Claim 3 (depends on 2) The chamber of claim 2, wherein the insulating protective layer comprises a metal oxide layer. ### Claim 4 (depends on 1) The chamber of claim 1, wherein each of the plurality of first screws has an end pushing against the chamber wall. ### Claim 5 (depends on 4) The chamber of claim 4, wherein the liner is spaced from the chamber wall by the plurality of first screws. ### Claim 6 (depends on 4) The chamber of claim 4, wherein the chamber wall comprises a plurality of view ports, the chamber further comprises a plurality of second screws screwed through the liner, and each of the plurality of second screws has an end inserted into a first through hole passing through the corresponding view port. ### Claim 7 (depends on 6) The chamber of claim 6, wherein the plurality of view ports comprises two view ports respectively located at two opposite sides of the chamber wall. ### Claim 8 (depends on 6) The chamber of claim 6, wherein each of the second screws is provided with a second through hole communicating the plasma processing area and the first through hole. ### Claim 9 A liner for a plasma system, wherein the plasma system comprises a chamber, the chamber comprises a lower chamber and an upper chamber defining a plasma processing area and a substrate supporter configured to support a substrate in the plasma processing area, the liner located in the lower chamber comprising: a liner body; and an insulating protective layer covering the liner body, for separating a chamber wall from the plasma processing area, wherein the liner has a side wall and a plurality of bottom tabs, the side wall is a ring surrounding along an inner sidewall of the lower chamber, the plurality of bottom tabs is connected to and extend from a bottom of the side wall toward the substrate supporter, the plurality of bottom tabs are spaced from each other, the liner is fixed to a bottom surface of the chamber wall in the lower chamber by screwing a plurality of first screws through the plurality of bottom tabs, and a topmost surface of the liner is lower than a topmost surface of the lower chamber. ### Claim 10 (depends on 9) The liner of claim 9, wherein the insulating protective layer comprises a metal oxide layer. ### Claim 11 (depends on 9) The liner of claim 9, wherein the liner body comprises aluminum, magnesium, titanium or a combination thereof. ### Claim 12 (depends on 9) The liner of claim 9, wherein the liner is provided with a plurality of first screw holes configured to be passed through by the plurality of first screws, and each of the plurality of first screws has an end pushing against the chamber wall. ### Claim 13 (depends on 9) The liner of claim 9, wherein the liner is provided with a plurality of second screw holes configured to be passed through a plurality of second screws, and each of the plurality of second screws has an end inserted into a first through hole passing through a view port of the chamber wall. ### Claim 14 (depends on 13) The liner of claim 13, wherein the plurality of second screw holes comprises two second screw holes respectively located at two opposite sides of the liner. ### Claim 15 A method for installing a liner to a plasma system, wherein the plasma system comprises a chamber, the chamber comprises a lower chamber and an upper chamber defining a plasma processing area and a substrate supporter configured to support a substrate in the plasma processing area, the method comprising: disposing the liner into the lower chamber for separating a chamber wall from the plasma processing area, wherein the liner has a side wall and a plurality of bottom tabs, the side wall is a ring surrounding along an inner sidewall of the lower chamber, the plurality of bottom tabs is connected to and extend from a bottom of the side wall toward the substrate supporter, the plurality of bottom tabs are spaced from each other, and a topmost surface of the liner is lower than a topmost surface of the lower chamber; and screwing a plurality of first screws through the plurality of bottom tabs of the liner to fix the liner onto a bottom surface of the chamber wall until an end of each of the plurality of first screws pushing against the chamber wall. ### Claim 16 (depends on 15) The method of claim 15, wherein the relative position of the liner with respect to the chamber wall is adjusted during the step of screwing the plurality of first screws through the liner toward the chamber wall. ### Claim 17 (depends on 15) The method of claim 15, further comprising spacing the liner from the chamber wall by the plurality of first screws. ### Claim 18 (depends on 15) The method of claim 15, further comprising screwing a plurality of second screws through the liner toward the chamber wall until an end of each of the plurality of second screws is inserted into a first through hole passing through a view port of the chamber wall. ### Claim 19 (depends on 18) The method of claim 18, wherein each of the second screws is provided with a second through hole communicating the plasma processing area and the first through hole. ### Claim 20 (depends on 1) The chamber of claim 1, further comprising a gas ring floating mounted between the lower chamber and the upper chamber.