Laminated magnetic materials for on-chip magnetic inductors/transformers

A method of forming a magnetic inductor, the method comprising:

• depositing a barrier layer directly on top of a wafer;
• depositing an adhesion layer directly on top of the barrier layer;
• depositing a magnetic seed layer directly on top of the adhesion layer, the magnetic seed layer comprising a layer of an alloy material, the layer of the alloy material is selected from a group consisting of NiFe, CoFe, NiFeBP, and CoFeBP;
• and
• alternatingly depositing magnetic layers and non-magnetic spacer layers such that an even number of the magnetic layers is deposited while an odd number of the non-magnetic spacer layers is deposited, the odd number being one less than the even number, the non-magnetic spacer layers comprising Ni3P, wherein depositing the non-magnetic spacer layers of Ni3P comprises using a combination of nickel, acetate, and hypophosphite at pH 4 to result in a ratio of 3:1 of Ni:P at 50-80 degrees Celsius, and wherein the magnetic layers are selected from a group consisting of CoWPB, NiFeBP, and CoFePB;
• forming an activation layer directly on the bottom and top of each of the magnetic layers, the activation layer being a separate layer and a separate material from the bottom and top of the magnetic layers, wherein the activation layer consists of Pd, the activation layer being a different layer and a different material from the non-magnetic spacer layers.