US 10,763,036 B2Granted

Composite electronic component and manufacturing method for same

AssigneeMurata Manufacturing Co., Ltd.

InventorsDaisuke Ishida, Kazuhide Kudo

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Abstract

A composite electronic component that includes a first electronic component that includes a first element body, a first functional element that is provided inside the first element body, and first outer electrodes that are provided on one surface of the first element body and are electrically connected to the first functional element. A second electronic component includes a second element body, a second functional element that is provided inside the second element body, and second outer electrodes that are provided on one surface of the second element body and are electrically connected to the second functional element. A resin body, in which the first electronic component and the second electronic component are buried, exposes the first outer electrodes and the second outer electrodes from the resin body.

Claims19

Dependent claims

A composite electronic component comprising:

a first electronic component including a first element body, a first functional element that is provided inside the first element body, and first outer electrodes provided on one surface of the first element body and electrically connected to the first functional element;
a second electronic component including a second element body, a second functional element provided inside the second element body, and second outer electrodes provided on one surface of the second element body and electrically connected to the second functional element;
a third electronic component that is electrically connected to the first electronic component and the second electronic component;
and
a resin body in which the first electronic component and the second electronic component are buried so as to be integrated with each other such that the first outer electrodes and the second outer electrodes are exposed from the resin body, wherein
the first outer electrodes and the second outer electrodes are exposed from one surface of the resin body, and
the third electronic component is arranged on another surface of the first element body that is on the opposite side from the one surface of the first element body, and on another surface of the second element body that is on the opposite side from the one surface of the second element body.

4 more elements

A composite electronic component manufacturing method for manufacturing a composite electronic component including a first electronic component having a first element body, a first functional element that is provided inside the first element body, and first outer electrodes provided on one surface of the first element body and electrically connected to the first functional element;

a second electronic component including a second element body, a second functional element provided inside the second element body, and second outer electrodes provided on one surface of the second element body and electrically connected to the second functional element;
and
a resin body in which the first electronic component and the second electronic component are buried so as to be integrated with each other such that the first outer electrodes and the second outer electrodes are exposed from the resin body, said composite electronic component manufacturing method comprising:
aligning the first electronic component and the second electronic component such that the one surface of the first element body and the one surface of the second element body are located in the same plane and face a base,
arranging a first resin sheet on another surface of the first element body that is on the opposite side from the one surface of the first element body and on another surface of the second element body that is on the opposite side from the one surface of the second element body, heating and pressurizing the first resin sheet, and thereby burying in the first resin sheet a portion of the first element body up to a point partway between the other surface and the one surface of the first element body in the height direction and a portion of the second element body up to a point partway between the other surface and the one surface of the second element body in the height direction,
arranging a second resin sheet on the one surface of the first element body and on the one surface of the second element body, heating and pressurizing the second resin sheet, and thereby burying in the second resin sheet a portion of the first element body up to a point partway between the one surface and the other surface of the first element body in the height direction and a portion of the second element body up to a point partway between the one surface and the other surface of the second element body in the height direction.

3 more elements

a second electronic component including a second element body, a second functional element provided inside the second element body, and second outer electrodes provided on one surface of the second element body and electrically connected to the second functional element;
and
a resin body in which the first electronic component and the second electronic component are buried so as to be integrated with each other such that the first outer electrodes and the second outer electrodes are exposed from the resin body, said composite electronic component manufacturing method comprising:
aligning the first electronic component such that the one surface of the first element body and the one surface of the second element body are located in the same plane and another surface of the first element body that is on the opposite side from the one surface of the first element body faces a base;
arranging a first resin sheet on the one surface of the first element body, heating and pressurizing the first resin sheet, and thereby burying in the first resin sheet a portion of the first element body up to a point partway between the one surface and the other surface of the first element body in the height direction;
aligning the second electronic component such that another surface of the second element body that is on the opposite side from the one surface of the second element body faces a base;
arranging the first resin sheet on the one surface of the second element body, heating and pressurizing the first resin sheet, and thereby burying in the first resin sheet a portion of the second element body up to a point partway between the one surface and the other surface of the second element body in the height direction;
and
arranging a second resin sheet on the other surface of the first element body and on the other surface of the second element body, heating and pressurizing the second resin sheet, and thereby burying in the second resin sheet a portion of the first element body up to a point partway between the other surface and the one surface of the first element body in the height direction and a portion of the second element body up to a point partway between the other surface and the one surface of the second element body in the height direction, wherein
the first electronic component and the second electronic component are aligned such that the one surface of the first element body and the one surface of the second element body are located in the same plane.

7 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/730,963Filed 12 Oct 2017
Priority: JP 2016-20713521 Oct 2016
Published: US 2018/0114633 A126 Apr 2018
Granted: 1 Sep 2020
Term ends: Not estimatedThe source records don’t support an estimate.

Classification12 codes

H01F 27/40
Details of transformers or inductances, in general: structural association with built-in electric component, e.g. fuse
H01F 27/24
Details of transformers or inductances, in general: magnetic cores
H01F 27/2804
Coils; Windings; Conductive connections: printed windings
H01F 27/292
Terminals; Tapping arrangements for signal inductances: surface mounted devices