Method of manufacturing an inductor
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJong Yoon Jang, Seok Hwan Ahn, Jeong Min Cho, Tae Hoon Kim, Jin Gul Hyun, Se Woong Paeng
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Abstract
There are provided an inductor and a method of manufacturing the same. The inductor includes: a body including a plurality of coil layers and high-rigidity insulating layers disposed on and beneath the plurality of coil layers; and external electrodes disposed on external surfaces of the body and connected to the coil layers. Build-up insulating layers are disposed between the high-rigidity insulating layers to cover the coil layers, and the high-rigidity insulating layers have a Young's modulus greater than that of the build-up insulating layers.
Claims20
A method of manufacturing an inductor, comprising:
- forming a first high-rigidity insulating layer having a first rigidity by applying a high-rigidity insulating material to a base substrate;
- forming a coil pattern on the high-rigidity insulating layer;
- forming a build-up insulating layer having a second rigidity lower than the first rigidity by applying a build-up insulating material to cover the high-rigidity insulating layer and the coil pattern;
- forming a via hole to expose an upper surface of the coil pattern formed in the build-up insulating layer and forming a via conductor in the via hole and another coil pattern on the build-up insulating layer;
- forming a laminate by repeatedly performing a process of forming the coil pattern, the build-up insulating layer having the second rigidity, and the via conductor, wherein each via conductor is formed at a different end of a respective coil pattern than a preceding via conductor;
- and
- forming a second high-rigidity insulating layer having the first rigidity by applying the high-rigidity insulating material to the laminate.
A method of manufacturing an inductor, comprising:
- forming a first high-rigidity insulating layer by applying a high-rigidity insulating material to a base substrate;
- processing a surface of the first high-rigidity insulating layer to increase surface roughness thereof, prior to forming a coil pattern and a build-up insulating layer thereon;
- forming the coil pattern on the surface having increased surface roughness of the high-rigidity insulating layer;
- forming the build-up insulating layer having a second rigidity lower than a first rigidity of the first high-rigidity insulating layer by applying a build-up insulating material to cover the surface having increased surface roughness of the high-rigidity insulating layer and the coil pattern;
- forming a via hole to expose an upper surface of the coil pattern formed in the build-up insulating layer and forming a via conductor in the via hole and another coil pattern on the build-up insulating layer;
- forming a laminate by repeatedly performing a process of forming the coil pattern, the build-up insulating layer, and the via conductor, wherein each via conductor is formed at a different end of a respective coil pattern than a preceding via conductor;
- and
- forming a second high-rigidity insulating layer by applying the high-rigidity insulating material to the laminate.
Dependencies are inferred from the claim text.