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US 10,763,016 B2Granted
Method of manufacturing a chip component
AssigneeRohm Co., Ltd.
InventorsHiroshi Tamagawa, Hiroki Yamamoto, Katsuya Matsuura, Yasuhiro Kondo
Life of this patent
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Abstract
A method for manufacturing a chip component includes forming an element, which includes a plurality of element parts, on a substrate. A plurality of fuses are formed, for disconnectably connecting each of the plurality of element parts to an external connection electrode. The external connection electrode, which is arranged to provide external connection for the element, is formed by electroless plating on the substrate.
Claims5
A method for manufacturing a chip component, comprising:
- forming an element, which includes a plurality of element parts, on a substrate;
- forming a plurality of fuses for disconnectably connecting each of the plurality of element parts to an external connection electrode;
- and
- forming the external connection electrode, which is arranged to provide external connection for the element, by electroless plating on the substrate,
- wherein the element parts are resistor bodies, and the chip component is a chip resistor,
- wherein the resistor bodies are formed by:
- forming a resistor body film on a top surface of the substrate;
- forming a wiring film in contact with the resistor body film;
- and
- forming the plurality of resistor bodies by patterning the resistor body film and the wiring film, and
- wherein the fuses are formed in the patterning of the resistor body film and the wiring film.
8 more elements
Dependencies are inferred from the claim text.